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Signal Integrity Pogo Pin IC Decapsulator(IC)

Country/Region china
Company Fantron Technologies(Shanghai) Co.,Ltd
Categories Signal Switch IC
Telephone 65-96853087, 65-67418318, 86-21-62773627, 62773067, 86-21-62771271, 86-20-37598797, 37598951, 86-20-37598795
ICP License Issued by the Chinese Ministry
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    Signal Integrity Pogo Pin IC Decapsulator(IC)

    IC ELITE ETCH AutomatedDual Acid Decapsulator
    IC、(IC)FPD(Flat Panel Display )

    - Single piece Silicon Carbide etch head/etch plate
    - Accurate Temperature Control
    - Real time etch time adjustment
    - Real time acid mixing
    - High maximum etch temperature
    - Post etch cooling of waste acids permitting safe use of a single waste bottle
    - Separate, hand held controller for remote operation
    - Automatic bottle sealing
    - Large etch head
    - Low contained volumes of acid
    - SEMI S2000 and CE Mark conformance
    - Consistently reproducible results
    - High sample throughput for maximum productivity
    - Fast temperature rise and cool times
    - Fast etch times
    - Wide range of package decapsulation 
    - Controllable re-etching capabilities via real time etching period adjustment
    - Reduced fume generation 
    - Wide range of operating temperatures

    Dimensions - (W x D x H)
    Decapsulator7.5 x 12.5 x 12 inch (190 x 318 x 305 mm)
    Bottle Assembly10 x 5 x 11 inch (254 x127 x 279 mm)
    Weightapprox. 35 lbs.(16 Kg)
    Power Source90~250 VAC
    Acid temp. range20~250℃
    Acid temp. set point1.00.1℃
    Etch cavity (up to)22 x 22 mm
    Choice of acid selectionfuming sulfuric acid
    fuming nitric acids
    mixed acids
    NOTE: All mix ratios are dynamically prepared within pumping assembly
    Acid mix ratios(nitric to sulfuric ratios)9:1, 5:1, 4:1, 3:1, 2:1, 1:1
    Post etch rinse optionsfuming sulfuric acid
    fuming nitiric acid
    mixed acids
    no rinse
    NOTE: Acid rinse temperature setttings are automatically calibrated
    to optimum etch temperatures.
    Etch times1 to 1,800 seconds (1 sec. increments)
    Dynamic (real time) adjustment of etch time
    Etch modalitiesPulse Etch, Reciprocal Etch Acid Pulse (REAP)
    NOTE: REAP is a superior approach to maximizing the carrying capacity for the etch acid(s) within the package volume. It allows superior etch characteristics when nitric acid or mixed acids are selected.
    Etch temperature ranges20 to 90℃ (nitric acid)
    20 to 250℃ (sulfuric acid)
    20 to 100℃ (mixed acids)
    Etchant acid volume selection1 to 6 ml. per minute for all acids and acid mixes
    Operator program storage100 programs stored to nonvolatile memory
    Software upgradesvia RS 232 computer link
    EMO Emergency Power Off switch
    Etch head safetyover temperature sensor circuitry
    Leak detection sensorsin Decapsulator Body
    in Bottle Box Assembly
    Secondary containmentTrue Secondary Containment
    Acid fume reductionWaste acid heat exchanger to minimize acid fuming
    Quality Signal Integrity Pogo Pin IC Decapsulator(IC) for sale
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