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Good Adhesion Conductor Paste , Low Volume Resistivity Conductive Silver Paste

Categories Low Temperature Silver Paste
Brand Name: LEED-INK
Model Number: DT1203
Certification: ISO9001, ISO14001, SGS, ROHS
Place of Origin: China
Price: Negotiable
Payment Terms: L/C, T/T, Western Union, Paypal
Delivery Time: Within 7 days after payment confirmed
Packaging Details: 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG/ Carton
Solid Content (%): 58-68
Drying: 130℃/30min + 180℃/30min
Adhesion/ Tape Pull (3M Scotch Tape #600): No Ag Transfer
Solderability: Dip Soldering Area: >90%
Dip Soldering Condition: Sn92 Ag 3.5cu0.5 (230℃-240℃, 1-5min)
Volume Resistivity: <2.4×10-4Ω·cm
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    Good Adhesion Conductor Paste , Low Volume Resistivity Conductive Silver Paste

    Low Volume Resistivity Good Adhesion Low Temperature Silver Paste for Tantalum Capacitors


    LEED-INK silver conductive paste DT1203 is a general purpose coating suitable for direct application to most substrates including plastics and it is special suitable for tantalum capacitors applications. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).

    It has features of low volume resistivity, good adhesion, excellent solder resistance, high electrically conductivity, etc.


    The low temperature curing conductive silver paste refers to the silver paste with curing temperature of 100-200℃. The silver paste DT1203 is mainly developed for capacitors including tantalum electrolytic capacitors and aluminum electrolytic capacitors.

    It is designed to exhibit good adhesion and excellent solder resistance purposes.



    Viscosity (Pa.S)

    (10rpm, 25℃, 2min)

    Solid Content63±5%
    Drying Temperature & Time130℃/30min + 180℃/30min
    Dip Soldering Condition

    Sn92 Ag 3.5cu0.5

    230℃-240℃ 1-5min

    SolderabilityDip Soldering Area: >90%
    Volume Resistivity<2.4×10-4Ω·cm
    Adhesion3M #600 Tape *1min, vertical pull, no Ag Transfer
    Shelf Life

    Six Months

    from Date of Shipment

    Feature Advantage

    1. High Electronic Conductivity

    The low temperature curing silver paste is with high electrical conductivity, and the volume resistance could be controlled under 2.4×10-4Ω·cm.

    2. Excellent Solder Resistance

    The silver paste DT1203 exhibits excellent solder resistance, and the dip soldering area is up to 90%.

    3. Good adhesion

    The tantalum capacitor using silver paste DT1203 is with good adhesion. Stick the printing surface with 3M tape and then quickly vertically pulled off, no Ag transfer.

    4. Good Hardness

    Test the hardness of a standard line with a pencil hardness tester, the hardness of silver paste DT1203 is equal to or greater than 2H. It presents good hardness property of the silver paste.

    5. Good printing properties

    The paste is with proper viscosity, good thixotropy and levelling properties which enables excellent printing properties. After screen printing, the film is well-distributed, fine and smooth.

    6. Environmental friendly, up to RoHS regulation

    The low temperature silver paste contains no toxic materials and heavy metal ions such as lead, Cadmium, nickel, and it is environmental friendly and meet environmental standard of RoHS regulation.

    7. Low Consumption

    the low temperature silver paste DT1203 is specially developed for low temperature curing applications. By years of improvement, we are keeping develop and reduced the noble metal content to reduce the cost and provide most cost efficient materials to the market.

    Quality Good Adhesion Conductor Paste , Low Volume Resistivity Conductive Silver Paste for sale
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