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Small smart board wires assembly 2 Layer Black Solder Mask HASL surface finish

Categories Turnkey PCB Assembly
Brand Name: YINGSTAR
Model Number: Yst-ym
Certification: UL/ROHS/CE
Place of Origin: China
MOQ: 5PCS
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
Delivery Time: 15-21working days
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Material: FR4
Layer: 2
Board thickness tolerance: ±10%
Outline tolerance: ±0.15mm 6mil
NO Plated hole dia tolerance: ±0.05mm 2mil
Surface finish: HASL
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    Small smart board wires assembly 2 Layer Black Solder Mask HASL surface finish

    Small smart boards with wires assembly 2 Layer Black Solder Mask HASL surface finish


    For the 4 layers PCB Circuit Board, it was made with FR - 4 board material, with only 1.2 mm board thickness. Also, the board size of this PCB Circuit Board is 235 * 170 mm, with blue solder mask and OSP surface treatment.

    Yingstar can offer main services :

    1. PCB fabrication
    2. Electronic parts purchasing
    3. PCB assembly and functional test,ect.

    Also we can offer the belowing:

    • Contract Manufacturing
    • Engineering Services
    • Keep left components in the BOM using moister buster cabinet
    • Prototyping
    • Cable and Wire Assembly, ect.

    We have the capabilities to assemble the following:


    1Ball Grid Array (BGA)5Quad Flat Pack No-Lead (QFN)
    2Small Outline Integrated Circuit (SOIC)6Plastic Leaded Chip Carrier (PLCC)
    3Quad Flat Package (QFP)7Ultra-Fine Ball Grid Array (uBGA)
    4Package-On-Package (PoP)8Small Chip Packages (pitch of 0.2 mm)

    Detailed terms for PCB assembly:


    Technical requirement:

    • Professional surface-mounting and through-hole soldering technology
    • Various sizes like 1206, 0805, 0603,0402,0201 components SMT technology
    • ICT (In Circuit Test), FCT (Functional Circuit Test) technology
    • PCB assembly with UL, CE, RoHS approval
    • Nitrogen gas reflow soldering technology for SMT
    • High standard SMT and solder assembly line
    • High density interconnected board placement technology capacity

    Quote requirement:


    • Gerber file and Bom list
    • Clear pics of pcba or pcba sample for us if possible
    • Test method or test fixture for PCBA if possible

    PCB and PCBA specification:


    Layer1-36 layer
    Max Board Size1100*599mm 43.3" * 24"
    Min Board Thickness4 layer 0.40mm 16mil
    6 layer 1.00mm 40mil
    8 layer 1.20mm 48mil
    10 layer 1.60mm 60mil
    Min space0.075mm 3mil
    Min line width0.075mm 3mil
    Min hole size0.1mm 4mil
    Plated wall thickness0.025mm 1mil
    Plated hole dia tolerance±0.10mm 4mil
    NO Plated hole dia tolerance±0.05mm 2mil
    Outline tolerance±0.15mm 6mil
    Twist and bent≤1.5%
    Board thickness tolerance±10%
    Copper weight0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
    Surface finishHASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
    Board materialFR-4 glass epoxy, FR4 High Tg, RoHS
    compliant; Aluminum, Rogers, etc.
    Insulation resistance1012Ω (Normal)
    Through hole resistance<300Ω(Normal)
    Electric strength>1.3KV/mm
    Current strength10A
    Peel strength1.5N/mm
    Thermal stress288℃20 Seconds
    Flammability94V-0
    Test voltage50-300V

    More details picture:


    Quality Small smart board wires assembly 2 Layer Black Solder Mask  HASL surface finish for sale
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