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OEM High Voltage Mosfet Transistor / AP10H03DF Uhf Power Transistor

Categories Mosfet Power Transistor
Brand Name: Hua Xuan Yang
Model Number: AP7H03DF
Certification: RoHS、SGS
Place of Origin: ShenZhen China
MOQ: Negotiation
Price: Negotiated
Payment Terms: L/C T/T Western Union
Supply Ability: 18,000,000PCS / Per Day
Delivery Time: 1 - 2 Weeks
Packaging Details: Boxed
Product name: High Voltage Mosfet Transistor
Model: AP7H03DF
Pack: DFN3*3-8L
Marking: AP7H03DF XXX YYYY
VDSDrain-Source Voltage: 30V
VGSGate-Sou rce Voltage: ±20A
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OEM High Voltage Mosfet Transistor / AP10H03DF Uhf Power Transistor

OEM High Voltage Mosfet Transistor / AP10H03DF Uhf Power Transistor


High Voltage Mosfet Transistor Description:


The AP10H03DF is the highest performance trench
N-ch MOSFETs with extreme high cell density,
which provide excellent RDSON and gate charge
for most of the small power switching and
load switch applications. The meet the RoHS and
Product requirement with full function reliability approved.


High Voltage Mosfet Transistor Features


VDS = 30V ID = 10A
RDS(ON) < 12mΩ @ VGS=4.5V
RDS(ON) < 16.5mΩ @ VGS=2.5V


Package Marking and Ordering Information


Product IDPackMarkingQty(PCS)
AP10H03DFDFN3*3-8LAP10H03DF XXX YYYY5000

Absolute Maximum Ratings (TA=25unless otherwise noted)


SymbolParameterRatingUnits
VDSDrain-Source Voltage30V
VGSGate-Source Voltage±20V
ID@TC=25℃Continuous Drain Current, V GS @ 10V 110A
ID@TC=100 ℃Continuous Drain Current, V GS @ 10V 18.2A
ID@TA=25℃Continuous Drain Current, VGS @ 10V19.5A
ID@TA=70℃Continuous Drain Current, V GS @ 10V 17.6A
IDMPulsed Drain Current275A
EASSingle Pulse Avalanche Energy 324.2mJ
IASAvalanche Current22A
PD@TC=25 ℃Total Power Dissipation426W
PD@TA=25 ℃Total Power Dissipation41.67W
TSTGStorage Temperature Range-55 to 150
TJOperating Junction Temperature Range-55 to 150
RθJAThermal Resistance Junction-Ambient 175℃/W
RθJCThermal Resistance Junction-Case 14.8℃/W

Electrical Characteristics (TJ=25, unless otherwise noted)


SymbolParameterConditionsMin.Typ.Max.Unit
BVDSSDrain-Source Breakdown VoltageVGS=0V , ID=250uA30------V
△BVDSS / T JBVDSS Temperature CoefficientReference to 25℃ , ID=1mA---0.023---V/℃
RDS(ON)Static Drain-Source On-ResistanceVGS=10V , I D=15A------12

VGS=4.5V , I D=10A------16.5
VGS(th)Gate Threshold Voltage

VGS=VDS , ID =250uA

1.0---2.5V
△VGS(th)VGS(th) Temperature Coefficient----5.08---mV/℃

IDSS


Drain-Source Leakage Current

VDS=24V , VGS=0V , TJ=25℃------1

uA

VDS=24V , VGS=0V , TJ=55℃------5
IGSSGate-Source Leakage CurrentVGS=±20V , V DS=0V------±100nA
gfsForward TransconductanceVDS=5V , ID=15A---24.4---S
RgGate ResistanceVDS=0V , VGS=0V , f=1MHz---1.8---Ω
QgTotal Gate Charge (4.5V)---9.82---
QgsGate-Source Charge---2.24---
QgdGate-Drain Charge---5.54---
Td(on)Turn-On Delay Time---6.4---
TrRise Time---39---
Td(off)Turn-Off Delay Time---21---
TfFall Time---4.7---
CissInput Capacitance---896---
CossOutput Capacitance---126---
CrssReverse Transfer Capacitance---108---
ISContinuous Source Current 1,5

VG=VD=0V , Force Current

------37A
ISMPulsed Source Current2,5------75A
VSDDiode Forward Voltage2VGS=0V , IS=1A , TJ=25℃------1V
SymbolParameterConditionsMin.Typ.Max.Unit
BVDSSDrain-Source Breakdown VoltageVGS=0V , ID=250uA30------V
△BVDSS / T JBVDSS Temperature CoefficientReference to 25℃ , ID=1mA---0.023---V/℃
RDS(ON)Static Drain-Source On-ResistanceVGS=10V , I D=15A------12

VGS=4.5V , I D=10A------16.5
VGS(th)Gate Threshold Voltage

VGS=VDS , ID =250uA

1.0---2.5V
△VGS(th)VGS(th) Temperature Coefficient----5.08---mV/℃

IDSS


Drain-Source Leakage Current

VDS=24V , VGS=0V , TJ=25℃------1

uA

VDS=24V , VGS=0V , TJ=55℃------5
IGSSGate-Source Leakage CurrentVGS=±20V , V DS=0V------±100nA
gfsForward TransconductanceVDS=5V , ID=15A---24.4---S
RgGate ResistanceVDS=0V , VGS=0V , f=1MHz---1.8---Ω
QgTotal Gate Charge (4.5V)VDS=15V , VGS=4.5V , ID=12A---9.82---
QgsGate-Source Charge---2.24---
QgdGate-Drain Charge---5.54---
Td(on)Turn-On Delay TimeVDD=15V , VGS=10V , RG=1.5
ID=20A
---6.4---
TrRise Time---39---
Td(off)Turn-Off Delay Time---21---
TfFall Time---4.7---
CissInput CapacitanceVDS=15V , VGS=0V , f=1MHz---896---
CossOutput Capacitance---126---
CrssReverse Transfer Capacitance---108---
ISContinuous Source Current 1,5

VG=VD=0V , Force Current

------37A
ISMPulsed Source Current2,5------75A
VSDDiode Forward Voltage2VGS=0V , IS=1A , TJ=25℃------1V

Note :

1 .The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.

2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%

3 .The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=22A

4.The power dissipation is limited by 175℃ junction temperature

5. The data is theoretically the same as I D and IDM , in real applications , should be limited by total power dissipation.


Attention


1, Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.

2, APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.

3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.

4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.

5,In the event that any or all APM Microelectronics products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law.

6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.

7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.

8, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use.


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