12H02TS Dual N Channel Mosfet Switch 20V Uninterruptible Power Supply

Name: 12H02TS Dual N Channel Mosfet Switch 20V Uninterruptible Power Supply
Brand: Hua Xuan Yang
Price: 1 USD

12H02TS Dual N Channel Mosfet Switch 20V Uninterruptible Power Supply

Categories	Mosfet Power Transistor
Place of Origin:	ShenZhen China
Brand Name:	Hua Xuan Yang
Certification:	RoHS、SGS
MOQ:	1000-2000 PCS
Price:	Negotiated
Packaging Details:	Boxed
Delivery Time:	1 - 2 Weeks
Payment Terms:	L/C T/T Western Union
Supply Ability:	18,000,000PCS / Per Day
Model Number:	12H02TS
Product name:	Mosfet Power Transistor
VDS:	20V
APPLICATION:	Uninterruptible Power Supply
FEATURE:	Low Gate Charge
VGS:	+-12V

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Shenzhen Hua Xuan Yang Electronics Co.,Ltd

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12H02TS Dual N Channel Mosfet Switch 20V Uninterruptible Power Supply

12H02TS 20V N+N-Channel Enhancement Mode MOSFET

Description

The 12H02TS uses advanced trench

technology to provide excellent RDS(ON) and low gate

charge . The complementary MOSFETs may be used to

form a level shifted high side switch, and for a host of other

applicatio

Application

● Power switching application

● Hard Switched and High Frequency Circuits

● Uninterruptible Power Supply

Absolute Maximum Ratings@Tj=25oC(unless otherwise specified)

Reflow Soldering

The choice of heating method may be influenced by plastic QFP package). If infrared or vapor phase heating is used

and the package is not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of

moisture in them can cause cracking of the plastic body. Preheating is necessary to dry the paste and evaporate the

binding agent. Preheating duration: 45 minutes at 45 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the

printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement. Several

methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput

times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface

temperature of the packages should preferable be kept below 245 °C for thick/large packages (packages with a

thickness 2.5 mm or with a volume 350 mm3 so called thick/large packages). The top-surface temperature of the

packages should preferable be kept below 260 °C for thin/small packages (packages with a thickness < 2.5 mm and a

volume < 350 mm3 so called thin/small packages).

Wave Soldering: Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printedhigh component density, as solder bridging and non-wetting can present major problems.

Manual Soldering: Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V oapplied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Whtool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

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12H02TS Dual N Channel Mosfet Switch 20V Uninterruptible Power Supply

12H02TS Dual N Channel Mosfet Switch 20V Uninterruptible Power Supply

12H02TS Dual N Channel Mosfet Switch 20V Uninterruptible Power Supply

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12H02TS Dual N Channel Mosfet Switch 20V Uninterruptible Power Supply