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Oversized, UAV PCB FR-4 902*902mm Rigid Flexible Printed Circuit Board , Large Circuit Board Industrial Drone

Categories Large PCB Prototype Board
Brand Name: China chao sheng
Model Number: cspcb1429
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 5-200K/pcs per month
Delivery Time: 20-25day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification: ISO/UL/RoHS/TS
Base material: FR-4Tg170+RO4350B
Board thickness: 1.6mm
Surface finishing: Immersion Gold
Min. line spacing: 3 Mil (0.075 Mm)
Min. line width: 0.075mm/0.1mm(3mil/4mil)
Min. hole size: 8 mil/6 mil
Copper thickness: 1oz
Product name: Printed Circuit Board
Type: pcb control board
Application: Consumer Electronics,Medical Device Consumer
Usage: Lithium Battery Packs
Solder mask: green
Name: PCB Board Production
Color: Green/White
Solder mask color: Blue.green.red.black.white.etc
Service: PCB/Components Sourcing/Soldering/Programming/Testing..
Product Area: Industrial UAV
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
TEST: 100% Electrical Test Prior Shipment
Surface Finishing: ENIG
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Oversized, UAV PCB FR-4 902*902mm Rigid Flexible Printed Circuit Board , Large Circuit Board Industrial Drone

Oversized, UAV PCB FR-4 902*902mm Rigid Flexible Printed Circuit Board , Large Circuit Board Industrial Drone

4layers plate thicknesssize902*902mm,rigid flex printed circuit boards PCB Board Service,industrial drone,circuit board pcb


Product Description

  1. 4layers plate thicknesssize902*902mm,rigid flex printed circuit boards PCB Board Service,industrial drone,circuit board pcb
  2. Product area: industrial drone
  3. Number of layers: 4layers plate thickness: 1.05mm;
  4. Size: 902*902mm/1PCS
  5. Process structure: high frequency FR-4TG170+LSOLA, minimum hole 0.250mm,
  6. minimum line width 4/4mil Impedance Ω ± 10%
  7. Packing: vacuum packaging + moisture-proof beads + humidity card + wooden box or carton packaging.
  8. Printed circuit board (pcb) and PCBA product areas
    Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
    Winding circuit board (fpc) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Our service

  1. Surface Mount PCB assembly (Both rigid PCB, flexible PCB)
  2. PCBA contract manufacturing
  3. Electronic contract manufacturing service
  4. Through hole assembly/DIP assembly
  5. Bonding assembly
  6. Final assembly
  7. Full Turnkey Box Build
  8. Mechanical / electrical assembly
  9. Supply Chain Management/Components procurement
  10. PCB fabrication
  11. Technical support

PCB process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supply

NO

supplier

Supply material name

Material origin

1

Japan

High frequency materials, PI, covering membrane,Copper berth

Mitsubishi Japan

2

dupont

High frequency materials, PI, covering film, dry film,Copper berth

Japan

3

panasonic

High frequency materials, PI, covering membrane,Copper berth

Japan

4

SanTie

PI, covering membrane

Japan

5

Born good

FR-4,PI,PP,Copper berth

shenzhen, China

6

A rainbow

PI, covering membrane,Copper berth

Taiwan

7

teflon

High frequency materials

The United States

8

Rogers

High frequency materials

The United States

9

Nippon Steel

PI, covering membrane,Copper berth

Taiwan

10

sanyo

PI, covering membrane,Copper berth

Japan

11

South Asia

FR-4,PI,PP,Copper berth

Taiwan

12

doosan

FR-4,PP

South Korea

13

Tai Yao plate

FR-4,PP,Copper berth

Taiwan

14

Alight

FR-4,PP,Copper berth

Taiwan

15

Yaoguang

FR-4,PP,Copper berth

Taiwan

16

Yalong

FR-4,PP

The United States

17

ISOAL

FR-4,PP

Japan

18

OAK

Buried, buried resistance, PP

Japan

19

United States 3M

FR-4,PP

The United States

20

Bergs

Copper and aluminum matrix

Japan

21

The sun

ink

Taiwan

22

Murata

ink

Japan

23

generous andbenevolent

PI, covering membrane,Copper berth

China's jiangxi

24

Yasen

PPI, covering membrane

China jiangsu

25

Yong Sheng Tai

ink

China guangdong panyu

26

mita

ink

Japan

27

Transcript

ceramic material

Taiwan

28

HOME

ceramic material

Japan

29

Fe-Ni-Mn

Alloy Invar, Section Steel

Taiwan


Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004


Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements


Quick Detail:

1. PCB Assembly on SMT and DIP

2. PCB schematic drawing/ layout /producing

3. PCBA clone/change board

4. Components sourcing and purchasing for PCBA

5. Enclosure design and plastic injection molding

6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

7. IC programming


Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray


PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED and other electronic products


FAQ:

Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB,PCBA products work well before shipping. We'll test all of them according to your test procedure.


Quality Oversized, UAV PCB FR-4 902*902mm Rigid Flexible Printed Circuit Board , Large Circuit Board Industrial Drone for sale
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