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| Categories | Multilayer PCB Board |
|---|---|
| Brand Name: | Bicheng Technologies Limited |
| Model Number: | BIC-509-V3.5 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD 9.99-99.99 per piece |
| Payment Terms: | T/T, Paypal |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 10 working days |
| Packaging Details: | Vacuum |
| Number of Layers: | 20 |
| Glass Epoxy: | TU-883 |
| Final foil external:: | 1.0oz |
| Final height of PCB:: | 3.0 mm ±10% |
| Surface Finish: | Immersion Gold |
| Solder Mask Color:: | Green |
| Colour of Component Legend: | White |
| Test: | 100% Electrical Test prior shipment |
TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
Brief Introduction
This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.
Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station, Office Routers
Detailed Specifications
| Item | Description | Actual | Result |
| 1. Laminate | Material Type | TU-883 | ACC |
| Tg | 170℃ | ACC | |
| Supplier | TUC | ACC | |
| Thickness | 2.8-3.1mm | ACC | |
| 2.Plating thickness | Hole Wall | 26.51µm | ACC |
| Outer copper | 41.09µm | ACC | |
| Inner Copper | 15µm / 31µm | ACC | |
| 3.Solder mask | Material Type | TAIYO/ PSR-2000GT600D | ACC |
| Color | Green | ACC | |
| Rigidity (Pencil Test) | 5H | ACC | |
| S/M Thickness | 20.11µm | ACC | |
| Location | Both Sides | ACC | |
| 4. Component Mark | Material Type | IJR-4000 MW300 | ACC |
| Color | White | ACC | |
| Location | C/S, S/S | ACC | |
| 5. Peelable Solder Mask | Material Type | / | |
| Thickness | / | ||
| Location | / | ||
| 6. Identification | UL Mark | YES | ACC |
| Date Code | 2921 | ACC | |
| Mark Location | Solder Side | ACC | |
| 7. Surface Finish | Method | Immersion Gold | ACC |
| Nickel Thickness | 4.06µm | ACC | |
| Gold Thickness | 0.056µm | ACC | |
| 8. Normativeness | RoHS | Directive 2015/863/EU | ACC |
| REACH | Directive 1907 /2006 | ACC | |
| 9.Annular Ring | Min. Line Width (mil) | 4.8mil | ACC |
| Min. Spacing (mil) | 5.2mil | ACC | |
| 10.V-groove | Angle | / | |
| Residual thickness | / | ||
| 11. Beveling | Angle | / | |
| Height | / | ||
| 12. Function | Electrical Test | 100% PASS | ACC |
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | ACC |
| Visual Inspection | IPC-A-600J &6012D Class 2 | ACC | |
| Warp and Twist | 0.21% | ACC | |
| 14. Reliability Test | Tape Test | No Peeling | ACC |
| Solvent Test | No Peeling | ACC | |
| Solderability Test | 265 ±5℃ | ACC | |
| Thermal Stress Test | 288 ±5℃ | ACC | |
| Ionic Contamination Test | 0.56µg/c㎡ | ACC |
Stackup & Impedance Controlled
HDI vias
|
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