Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
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Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance. Features and Benefits Silicone free...
ZSUN CHIPS CO., LTD
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Self Adhesive silicone free Thermal Pad 2W/MK For Camera Silicone Sensitive Products
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... interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well...
Dongguan Ziitek Electronical Material and Technology Ltd.
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2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module
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...Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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2 W/m.K Thin Silicone Free Thermal Pad Multipurpose For Hard Disk
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...Thermal Conductivity Blue Silicone Free Thermal Pad For Hard Disk Attribute Value Test Method Composition Acrylate - Color Blue Visual Thickness(mm) 0.5-10.0 ASTM D374 Density(g/cc) 2.9 ASTM D792 Hardness(shore oo) 45±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Application of silicon free thermal......
Shenzhen Aochuan Technology Co., Ltd
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler
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..., thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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...Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and bonding materials configured in a certain ratio, and processed through a special process to become a paste gap filling material......
Trumony Aluminum Limited
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ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease
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... with a pre-flash viscosity of 80 Pa·s, post-flash viscosity of 700 Pa·s, thermal conductivity of 6.2 W/m·K, thermal resistance of 6.1 mm²·K/W, and bond line thickness of 26 μm. Product Overview Optimized for screen printing, stencil printing,...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials
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... thermal conductivity, manufactured through advanced high-temperature melting technology. With its unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials, ceramic......
Shaanxi KeGu New Material Technology Co., Ltd
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